Form：Hua Hong Semiconductor 2017/12/27Browse：4912
Hua Hong Semiconductor Co., Ltd. today announced the successful mass production of its second-generation 90-nm G2 eFlash process platform with enhanced technical strength and competitiveness.
Form： 2017/12/25Browse：5726
This week, according to the Yonhap news agency, Samsung Electronics announced that it has started using the second-generation 10nm process to produce 8Gb DDR4 particles, another iteration of technology after two years of the first-generation 10nm process.
Form：Tektronix 2017/9/22Browse：6450
Tektronix, the world's leading supplier of measurement solutions, today introduced the new DPO7OE1, a calibrated optical probe and analysis software for use with real-time oscilloscopes, and is an optical reference for compatibility with 28-GBaud PAM4 applications Receiver (ORR), and can support IEEE / OIF-CEI standard specific measurement. The new solution complements Tektronix's sampling oscilloscope optical PAM4 analysis tool, providing the design team with an effective test solution for all stages of the optical transmitter workflow.
Form：Western Digital (WD) 2017/9/19Browse：5557
SAN FRANCISCO (MarketWatch) - Western Digital Inc. (NYSE: TXN) today announced the launch of the 400GB Flash Digital High-Speed Mobile MicroSDXC UHS-I card, a microSD card for high-capacity mobile devices. After two years ago, after launching the 200GB Red Dodge high-speed mobile microSDXC card, Western Digital Inc. doubled storage capacity to double the same volume of SD card to 400GB.
Form：KLA-Tencor 2017/9/18Browse：5410
KLA-Tencor today introduced five development control systems for logic and cutting-edge memory design nodes below 7 nm to help wafer manufacturers achieve the rigorous process tolerances required for multiple exposure techniques and EUV lithography. At the IC manufacturing facility, the ATL stacking measurement system and the SpectraFilmF1 thin film measurement system provide process characterization analysis and offset monitoring for the fabrication of finFET, DRAM, 3D NAND and other complex component structures.
Form：National Instruments 2017/9/6Browse：4216
NI (National Instruments, National Instruments, Inc.) as a commitment to engineers and scientists to provide solutions to meet the world's most serious engineering challenges of the supplier, today announced the launch of a series of PCI Express Gen 3 connected high-performance PXI Remote control and bus expansion module. PCI Express Gen 3 technology provides higher bandwidth, which brings the gospel to applications such as 5G mobile research, RF recording and playback, and high-channel data acquisition, which require significant amounts of data.
Form：Hua Hong Semiconductor 2017/9/4Browse：5099
("Hua Hong Semiconductor" or "Company", together with its subsidiaries, collectively the "Group", stock code: 1347.HK) announced today that the Company's announcement of the Company's Microcontroller Unit (MCU) market, the latest launch of 95 nm single insulated gate non-volatile embedded memory (95 nm 5V SG eNVM) process platform. In ensuring the stability of the product at the same time, 95 nm 5V SG eVM process platform for its low power consumption, low cost advantage, widely favored by customers. The platform has been successfully mass production, product performance.
Form：LEM Electronics 2017/9/4Browse：4725
Power market leader in the field of sensors and high-quality power measurement solutions provider LME Electronics recently debut in Shanghai opened the ninth session of the Shanghai International Charging Station (Pile) Technology and Equipment Exhibition, the exhibition site to show its low-power charger , High-power charger and battery detection field of leading-edge technology, with nearly 200 customers to exchange demand and details Lyme Electronics latest solutions, with action to promote the charging infrastructure.
Form：Rogers 2017/8/28Browse：4245
Rogers is pleased to introduce the CLTE-MW laminate. This is a ceramic-filled PTFE glass fiber reinforced composite circuit material designed for circuit design engineers to optimize costs and improve performance and development. This unique circuit material system is well suited for applications where the thickness is limited or controlled due to physical or electrical characteristics.
Form：Pico Technology 2017/8/28Browse：4312
Pico Technology, the market leader in PC oscilloscopes and data loggers, today introduced the DeepMeasure analysis tool. As a standard configuration for the PicoScope 3000, 4000, 5000 and 6000 series oscilloscopes, DeepMeasure provides automatic measurement of waveform parameters up to tens of millions of continuous waveform cycles. The results can be sorted easily, analyzed and associated with the waveform display.
